Press Release


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August 30, 2000



Issues of The Eighth and The Ninth Series Unsecured Bonds


Sony Corporation (the "Corporation"), today, has determined to issue 2 tranches of straight bonds, with total amount of 150 billion yen, under the domestic bond shelf registration (Scheduled maximum aggregate issue price: 300 billion yen, effective period: through July 26, 2002). The Corporation intends to use the proceeds of the issues for Sony group's capital expenditure in the semiconductors business.

The terms of the issues are as follows:

The Eighth Series Unsecured Bonds (the "Bonds")



1Total amount of issue:100 billion yen
2Denomination of each Bond:100 million yen
3Form of Bonds:Bearer Bonds with Coupons
4Interest rate:1.42% per annum
5Issue price:99.98% of the principal amount
6Redemption price:100% of the principal amount
7Maturity date:September 13, 2005
8Offering period:August 30, 2000
9Payment date:September 13, 2000
10Method of offering:Public offering; provided, however, that the
Bonds shall not be offered in the United States,
or to any U.S. persons.
11Security:The Bonds are not secured by any pledge,
mortgage or other charge on any assets or
revenues of the Corporation or of others nor
guaranteed. There are no assets reserved as
security for the Bonds.
12Special Covenants:The Bonds are subject to certain covenants
relating to the negative pledge.
13Redemption prior to
maturity:
The Corporation may, at any time after the
issue of the Bonds, purchase the Bonds and
have such purchased Bonds canceled.
14Interest payment dates:March 13 and September 13 of each year
15Lead manager and Book-
runner:
The Nomura Securities Co., Ltd.
16Fiscal agent:The Sakura Bank, Limited
17Ratings:The Bonds have been given ratings of "Aa3"
from Moody's Investors Service Inc., "A+"
from Standard & Poor's, and "AA+" from
Rating and Investment Information, Inc.



The Ninth Series Unsecured Bonds (the "Bonds")



1Total amount of issue:50 billion yen
2Denomination of each Bond:100 million yen
3Form of Bonds:Bearer Bonds with Coupons
4Interest rate:2.04% per annum
5Issue price:99.94% of the principal amount
6Redemption price:100% of the principal amount
7Maturity date:September 13, 2010
8Offering period:August 30, 2000
9Payment date:September 13, 2000
10Method of offering:Public offering; provided, however, that the
Bonds shall not be offered in the United States,
or to any U.S. persons.
11Security:The Bonds are not secured by any pledge,
mortgage or other charge on any assets or
revenues of the Corporation or of others nor
guaranteed. There are no assets reserved as
security for the Bonds.
12Special Covenants:The Bonds are subject to certain covenants
relating to the negative pledge.
13Redemption prior to
maturity:
The Corporation may, at any time after the
issue of the Bonds, purchase the Bonds and
have such purchased Bonds canceled.
14Interest payment dates:March 13 and September 13 of each year
15Lead manager and Book-
runner:
The Nomura Securities Co., Ltd.
16Fiscal agent:The Sakura Bank, Limited
17Ratings:The Bonds have been given ratings of "Aa3"
from Moody's Investors Service Inc., "A+"
from Standard & Poor's, and "AA+" from
Rating and Investment Information, Inc.