Fujitsu and Sony to Cooperate in the Development
and Manufacture of Next Generation System LSI Chips
Fujitsu Limited and Sony Corporation plan to cooperate in the development, design, and manufacture of next generation 0.18mm system LSI chips. The two companies will begin holding discussions with the prospect of concluding a formal contract later this spring.
This cooperation comes at a time when changes within the semiconductor industry such as increased research and development costs, expanded capital investment requirements, and enlargements in semiconductor chip scale have made it increasingly difficult for companies to pursue technological innovations alone.
Fujitsu and Sony expect improved design efficiency and shortened product development times to result from cooperation in the development, design, and manufacture of next generation system LSI chips. They also anticipate that their cooperation will help establish a strong business position for the new technology.
Basic Framework of Cooperation: