In recent years, mobile devices have become ever more sophisticated in terms of advanced functionality and high resolution displays. As a result, more wiring connections have been used to accommodate the increasing volume of data being transmitted within devices.
Accordingly, new problems began to emerge as connectors in devices became larger and it became more difficult to bend the connecting cables.
Sony's newly-developed 'single wire interface technology' has achieved bi-directional transmission of several kinds of signals, including video, audio and control signals, by using time division duplex and multiplex*1. In addition, the DC power is supplied on the same signal cable. Sony's unique encoding technology*2 with DC balance enables both DC power supply and high speed data to be transmitted within a limited frequency bandwidth.
In order to swiftly begin practical implementation of this technology, Sony has teamed up with ROHM Co., Ltd. ('ROHM'), which has a track record in peripheral technologies, for the joint development and technical validation for the analog portion of the test chip.
Hereafter, Sony will grant ROHM a license for the IP of the digital portion of this newly-developed technology in order to advance the development of a single chip which includes both the analog and digital portions.