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Sony Semiconductor Quality and Reliability HandBook
(PDF file) [Revised in August, 2011]
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Chapter 1 Approach to Quality Assurance [PDF(0.2MB)]
1.1 Approach toward Quality Assurance 1.2 Quality Assurance System for Semiconductor Products 1.3 Environmental Approaches 1.4 Product Liability (PL) Act Chapter 2 Semiconductor Device Reliability Verification[PDF(0.8MB)] 2.1 Fundamental Knowledge on Semiconductor Reliability 2.2 Semiconductor Reliability Verification 2.3 Acceleration Model Chapter 3 Semiconductor Device Failure Analysis[PDF(1.6MB)] 3.1 What is Failure Analysis? 3.2 Necessity of Failure Analysis Technology 3.3 Failure Analysis Technology Chapter 4 Notes on the Handling of Semiconductor Devices[PDF(1.0MB)] 4.1 Soldering Heat Resistance 4.2 Notes on Handling for Electric Breakdown 4.3 Notes on Handling for Mechanical Breakdown 4.4 Notes on Handling to Prevent Thermal Breakdown 4.5 Notes on Product Specifications, Packing, Transport and Storage Chapter 5 Notes for Each Product Category and Other Noteworthy Items[PDF(0.5MB)] 5.1 Image Sensors 5.2 Laser Diode 5.3 LCD 5.4 Quality Assurance of Bare Die 5.5 Product Name and Lot Indications Issued by : Quality and Reliability division , Semiconductor Business Group, Professional, Device & Solution Group , Sony Corporation Contact us : Mail address: SCRLBOOK@jp.sony.com |
Notes
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