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Product Name (1) IC (example) CX*1 A*2 3562*3 A*4 Q*5 *1 : Sony IC mark *2 : Product category mark A : Bipolar linear IC B : Bipolar digital IC D : MOS IC G : GaAs IC M : Multi-chip module P : Microcomputer R : *3 : Product number *4 : Improvement mark *5 : Package mark EN : Very Thin Small Outline Non- leaded Package ER : Very Thin Quad Flat Non- leaded Package FN :FSmall Outline Flat- leaded Package with Heat Sink GP : Plastic Ball Grid Array GG :FFine Pitch Ball Grid Array GA : Fine Pitch Land Grid Array GH : Tape Fine Pitch Land Grid Array GL : Very thin Fine Pitch Land Grid Array J : Quad Flat J- leaded Package K : Quad Flat Non- leaded Package L : Single In- line Package/Zig- zag In- line Package M : Small Outline Package N : Shrink Small Outline L- leaded Package P : Dual In- line Package Q : Quad Flat Package R : Low Profile Quad Flat L- leaded Package S : Shrink Dual In- line Package TM : Thin Small Outline Package TN : Slim Type Thin Small Outline Package TQ : Thin Quad Flat Package

2) CCD (1) Area image sensor (example) ICX*1 412*2 A*3 Q*4 F*5 *1 : Sony CCD area image sensor mark *2 : Product number *3 : Improvement mark *4 : Classification for filter ( Color, B/W, etc.) *5 : Package mark (2) Linear sensor (example) ILX*1 751*2 K*3 XX*4 *1 : Sony CCD linear sensor mark *2 : Product number *3 : Improvement mark *4 : Filter or package mark

(3) LCD (1) High temperature LCD (example) LCX*1 033*2 A*3 N*4 B*5 M*6 *1 : Sony high temperature LCD mark *2 : Product number *3 : Improvement mark *4 : Classification for display *5 : Mount format mark *6 : XXXXX (2) Low temperature LCD (example) ACX*1 704*2 A*3 K*4 M*5 *1 : Sony low temperature LCD mark *2 : Product number : 300 to 499 (Transmission) / 700 to 999 (Reflection) *3 : Improvement mark *4 : Classification for display *5 : Mount, module format mark (3) Laser diode (example) SLD*1 1133*2 VL*3- 25*4 *1 : Sony laser diode mark *2 : Product number *3 : Package mark *4 : wavelength rank

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