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| Package Inserted Type |
| Type | Package name | Package | Material* | Lead pitch | Lead shape | Lead pull-out direction |
Sony Package mark |
|
|---|---|---|---|---|---|---|---|---|
| Symbol | Description | |||||||
| Standard | DIP | Dual In-line Package |
 |
P C |
2.54mm (100mil) |
Through Hole Lead |
2-direction | P G |
| SIP | Single In-line Package |
 |
P | 1-direction | L | |||
| ZIP | Zig-zag In-line Package |
 |
2.54mm (100mil) Zigzag in-line |
|||||
| PGA | Pin Grid Array |
 |
C | 2.54mm (100mil) |
Package bottom |
G | ||
| PIGGY BACK |
Piggy Back |  |
2-direction | - | ||||
| Shrink | SDIP | Shrink Dual In-line Package |
 |
P | 1.778mm (70mil) |
S | ||
| SZIP | Shrink Zig-zag In-line Package |
|
1.778mm (70mil) Zigzag in-line |
1-direction | L | |||
| * p : Plastic, C : Ceramic |
| Surface Mounted Type |
| Type | Package name | Package | Material*1 | Lead pitch | Lead shape | Lead pull-out direction |
Sony Package mark |
|
|---|---|---|---|---|---|---|---|---|
| Symbol | Description | |||||||
| Standard flat package |
QFP | Quad Flat Package |
 |
P | 1.0mm 0.8mm 0.65mm 0.5mm |
Gull- Wing | 4-direction | Q |
| SOP | Small Outline Package |
 |
1.27mm (50mil) |
2-direction | M | |||
| Shrink flat package |
LQFP | Low Profile Quad Flat L- leaded Package |
 |
0.8mm 0.65mm 0.5mm [1.7mm (Max.)] |
4-direction | R | ||
| TQFP | Thin Quad Flat Package |
 |
0.5mm 0.65mm [1.2mm (Max.)] |
TQ | ||||
| SSOP | Shrink Small Outline L- leaded Package |
 |
0.65mm 0.8mm |
2-direction | N | |||
| TSSOP | Thin Shrink Small Outline L- leaded Package |
 |
0.5mm [1.2mm (Max.)] |
TN | ||||
| HSOP | Small Outline Flat- leaded Package with Heat Sink |
 |
0.65mm 0.4mm |
Flat- Lead | FN | |||
| TSOP | Thin Small Outline Package |
 |
1.27mm 0.8mm [1.2mm (Max.)] |
Gull- Wing | TM YM TN*2 YN*2 |
|||
| VSON | Very Thin Small Outline Non- leaded Package |
 |
0.4mm 0.5mm [1.0mm (Max.)] |
Leadless | 2-direction, package bottom |
EN | ||
| VQFN | Very Thin Quad Flat Non- leaded Package |
 |
4-direction, package bottom |
ER | ||||
| Standard chip carrier |
QFN (LCC) |
Quad Flat J- leaded Package |
 |
C | 1.27mm (50mil) |
Package side |
K | |
| Ball grid array |
FBGA | Fine Pitch Ball Grid Array |
 |
P | 0.8mm | Leadless Ball Array |
Package bottom |
GG |
| P- BGA | Plastic Ball Grid Array |
1.27mm (50mil) |
GP | |||||
| T- BGA | Tape Ball Grid Array |
GF | ||||||
| Chip size package |
LFLGA (CSP) |
Low Profile Fine Pitch Land Grid Array |
 |
0.8mm 0.65mm 0.5mm [1.7mm (Max.)] |
GA | |||
| TFLGA (CSP) |
Tape Fine-Pitch Land Grid Array |
0.8mm 0.65mm 0.5mm [1.2mm (Max.)] |
GH | |||||
| VFLGA (CSP) |
Very Fine-Pitch Land Grid Array |
0.8mm 0.65mm 0.5mm [1.0mm (Max.)] |
GL | |||||
| *1 : P : Plastic, C : Ceramic *2 : TN, Yn : Slim TSOP |
| Package Mark General Common Marks for IC |
| Mark | Package mark | Description |
|---|---|---|
| EQ | QFN | Mounting height above 1 mm |
| EN | VSON | Mounting height below 1 mm |
| ER | VQFN | Mounting height below 1 mm |
| F | Film carrier | |
| FL | HZIP | |
| FN | HSOF | |
| GP | PGA/HPGA | Pin grid array |
| GG | LFBGA/TFBGA/VFBGA | Ball grid array(Plastic), ball pitch below 0.8 mm |
| GF | T- BGA | Ball grid array(Tape), ball pitch 1.27 mm/1.0 mm |
| GA | LFLGA | Land grid array(Plastic), land pitch below 0.8 mm |
| GL | VFLGA | Land grid array(Plastic), land pitch below 0.8 mm |
| GH | TFLGA | Land grid array(Plastic), land pitch below 0.8 mm |
| J | SOJ | |
| K | Chip carrier | |
| L | SIP/ZIP | |
| M | SOP | |
| N | SSOP (Including old VSOP) | |
| P | DIP (Plastic) | |
| Q | QFP | |
| R | LQFP (Including old VQFP) | |
| S | Shrink DIP | |
| SP | Slim DIP | |
| TM | TSOP (Normal lead) | |
| TN/YN | TSSOP | |
| TQ | TQFP |
| Note) Other than ICs, refer to the respective category standards. |
