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Package Inserted Type

Type	Package name		Package	Material*	Lead pitch	Lead shape	Lead pull-out direction	Sony Package mark
	Symbol	Description
Standard	DIP	Dual In-line Package		P C	2.54mm (100mil)	Through Hole Lead	2-direction	P G
	SIP	Single In-line Package		P			1-direction	L
	ZIP	Zig-zag In-line Package			2.54mm (100mil) Zigzag in-line
	PGA	Pin Grid Array		C	2.54mm (100mil)		Package bottom	G
	PIGGY BACK	Piggy Back					2-direction	-
Shrink	SDIP	Shrink Dual In-line Package		P	1.778mm (70mil)			S
	SZIP	Shrink Zig-zag In-line Package			1.778mm (70mil) Zigzag in-line		1-direction	L

* p : Plastic, C : Ceramic

Surface Mounted Type

Type	Package name		Package	Material*1	Lead pitch	Lead shape	Lead pull-out direction	Sony Package mark
	Symbol	Description
Standard flat package	QFP	Quad Flat Package		P	1.0mm 0.8mm 0.65mm 0.5mm	Gull- Wing	4-direction	Q
	SOP	Small Outline Package			1.27mm (50mil)		2-direction	M
Shrink flat package	LQFP	Low Profile Quad Flat L- leaded Package			0.8mm 0.65mm 0.5mm [1.7mm (Max.)]		4-direction	R
	TQFP	Thin Quad Flat Package			0.5mm 0.65mm [1.2mm (Max.)]			TQ
	SSOP	Shrink Small Outline L- leaded Package			0.65mm 0.8mm		2-direction	N
	TSSOP	Thin Shrink Small Outline L- leaded Package			0.5mm [1.2mm (Max.)]			TN
	HSOP	Small Outline Flat- leaded Package with Heat Sink			0.65mm 0.4mm	Flat- Lead		FN
	TSOP	Thin Small Outline Package			1.27mm 0.8mm [1.2mm (Max.)]	Gull- Wing		TM YM TN*2 YN*2
	VSON	Very Thin Small Outline Non- leaded Package			0.4mm 0.5mm [1.0mm (Max.)]	Leadless	2-direction, package bottom	EN
	VQFN	Very Thin Quad Flat Non- leaded Package					4-direction, package bottom	ER
Standard chip carrier	QFN (LCC)	Quad Flat J- leaded Package		C	1.27mm (50mil)		Package side	K
Ball grid array	FBGA	Fine Pitch Ball Grid Array		P	0.8mm	Leadless Ball Array	Package bottom	GG
	P- BGA	Plastic Ball Grid Array			1.27mm (50mil)			GP
	T- BGA	Tape Ball Grid Array						GF
Chip size package	LFLGA (CSP)	Low Profile Fine Pitch Land Grid Array			0.8mm 0.65mm 0.5mm [1.7mm (Max.)]			GA
	TFLGA (CSP)	Tape Fine-Pitch Land Grid Array			0.8mm 0.65mm 0.5mm [1.2mm (Max.)]			GH
	VFLGA (CSP)	Very Fine-Pitch Land Grid Array			0.8mm 0.65mm 0.5mm [1.0mm (Max.)]			GL

*1 : P : Plastic, C : Ceramic *2 : TN, Yn : Slim TSOP

Package Mark General Common Marks for IC

Mark	Package mark	Description
EQ	QFN	Mounting height above 1 mm
EN	VSON	Mounting height below 1 mm
ER	VQFN	Mounting height below 1 mm
F	Film carrier
FL	HZIP
FN	HSOF
GP	PGA/HPGA	Pin grid array
GG	LFBGA/TFBGA/VFBGA	Ball grid array(Plastic), ball pitch below 0.8 mm
GF	T- BGA	Ball grid array(Tape), ball pitch 1.27 mm/1.0 mm
GA	LFLGA	Land grid array(Plastic), land pitch below 0.8 mm
GL	VFLGA	Land grid array(Plastic), land pitch below 0.8 mm
GH	TFLGA	Land grid array(Plastic), land pitch below 0.8 mm
J	SOJ
K	Chip carrier
L	SIP/ZIP
M	SOP
N	SSOP (Including old VSOP)
P	DIP (Plastic)
Q	QFP
R	LQFP (Including old VQFP)
S	Shrink DIP
SP	Slim DIP
TM	TSOP (Normal lead)
TN/YN	TSSOP
TQ	TQFP

Note) Other than ICs, refer to the respective category standards.

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