| MEMS Foundry Business Start: April 1, 2004 | |
| Location | Kirishima City, Kagoshima Prefecture, Japan |
| Clean Room | |
| Clean rating | Class 1-1000 |
| Wafer size | 6 inch |
| Production capacity | Small volume engineering samples - mass production |
| Services | Engineering samples, Production |
| ISO, etc. | ISO9001, TS16949 |
| MP/ES experience | Microphone, Various sensors, Actuators |
| Process technology | Bulk processing including SOI, Surface processing, Mixed signal semiconductor processing |
| Equipment | |
| Photolythography | Stepper, Double sided aligner, Coater, Developer |
| Heat treatment/diffusion | Diffusion, Ionic diffusion |
| Deposition | LPCVD, PCVD, Sputter, Vapor deposition, DopedPoly |
| Dry etch | RIE, DeepRIE, Asher |
| Wet etch | HF, KOH, Resist removal |
| Bonding | Metal bonding, Glass frit bonding |
| Cleaning | RCA, Organic cleaning |
| Other | Plating, Lift off |
| LowStress SiN, LowStress Poly, LowStress Epi Si | |
| Epi | |
| Laser dicing (Stealth) | |
| Design/Analysis | LSI design, Analysis environment |
| Measurement/Evaluation | LSI & MEMS measurement, Evaluation environment |
| Assembly/Packaging | LSI assembly |
