| MEMS Foundry Business Start: April 1, 2004 | |
| Location | Kirishima City, Kagoshima Prefecture, Japan |
| Clean Room | |
| Clean rating | Class 1-1000 |
| Wafer size | 6 inch |
| Production capacity | Small volume engineering samples - mass production |
| Services | Engineering samples, Production |
| ISO, etc. | ISO9001, TS16949, ISO14001 |
| Development/Production experience |
Sensor, Actuators |
| Process technology | Bulk processing including SOI, Cavity-SOI, Surface processing, Mixed signal semiconductor processing |
| Equipment | |
| Photolythography | Stepper, Double sided aligner, Coater, Developer |
| Heat treatment/diffusion | Diffusion, Ionic diffusion |
| Deposition | LPCVD, PCVD, Sputter, Vapor deposition, Doped Poly, Epi Poly |
| Dry etch | RIE, DeepRIE, Asher |
| Wet etch | HF, KOH, Resist removal |
| Bonding | Metal bonding, Glass frit bonding |
| Cleaning | RCA, Organic cleaning |
| Other | Plating, Lift off |
| LowStress SiN, LowStress Poly, LowStress Epi Si | |
| Epi | |
| Laser dicing (Stealth) | |
| Design/Analysis | LSI design, Analysis environment |
| Measurement/Evaluation | LSI & MEMS measurement (Probing), Evaluation environment |
| Assembly/Packaging | LSI assembly |
♦TSV (Through Silicon Via)
Features
·High aspect ratio TSV
·High-density TSV
♦WLP (Wafer Level Package)
Features
·Au - Si Eutectic Bonding
·Vacuum Sealing
·Au - Au Bonding
·Glass Frit Bonding
·Resin Bonding
♦Deep RIE Process
Features
·High aspect ratios
·Various taper angles
·Filling
♦Epi Poly Process
Features
·Thick Poly-Si
·Low-resistance Poly-Si
·Low-stress Poly-Si
Our Turnkey Business offers a one stop shop from design through manufacturing.
Please contact us if you have any questions.
