2. Handling Precautions and Reliability

2-1. (5) Mechanical Stress

1. Outer lead bending
   Note that when using products with outer leads, the outer leads may bend caused by the handling method.
2. Outer lead pull-out
   Note that when using products with outer leads, the outer leads may be pulled out when pulled on strongly or pushed in when pushed in strongly. In addition, when the insulating glass at the base of the outer lead becomes damaged, the product may become unable to maintain the internal sealed state, and the internal wiring connections may be damaged. In particular, be sure to completely free the outer leads when removing a mounted laser diode.
3. Package damage
   Note that applying strong force to the package of laser diodes may cause adhered materials to separate or the package to deform or become chipped or cracked.
4. Window glass, lens or other damage
   Note that laser diodes may become damaged, contaminated, cracked or parts may fall off when strong force is applied to the window glass, lens or other parts.
   Also note that applying strong force to the package may cause the package to deform or the window glass, lens or other parts to become cracked or fall off.
5. Internal element damage
   Take care to prevent foreign matter from entering the inside of the package of open-package products, as this may damage the internal elements.