 Multimode and Multiband Support |
|
The implementation of LTE terminals requires
capability to select the telecommunications
system that a location requires. This demands
multimode capability that complies not only
with LTE, but also existing telecommunications
systems such as CDMA, UMTS and GSM. The
700 MHz band and 2.5 GHz band has recently
been added to LTE but multiband capability that
provides support for other telecommunications
systems and multiple frequency bands will also
be essential. We have developed three types of
products that provide the required number of
bands. (See figure 1.)
CXM3555ER: SP10T (5TRx/2Tx/3Rx)
CXM3558ER: SP10T (4TRx/2Tx/4Rx)
CXM3553ER: SP12T (6TRx/2Tx/4Rx) |
| Low insertion Loss, High
Isolation and Low Distortion |
|
Multimode and multiband capability involving
LTE is affected by insertion loss degradation and transmission/reception signal interference
(isolation and distortion) in the high-frequency
band (LTE (2.5 GHz band)). The use of low-distortion
devices developed based on a Sony's
unique JPHEMT*2 process and optimization
of a GaAs switching circuit configuration
have yielded low insertion loss, high isolation
and low distortion devices that overcome
these issues. Low insertion loss leads to low
current consumption during transmission and
combined with high isolation and low distortion
contributes to greater reception sensitivity. (See
table 1.)
*2: JPHEMT: Junction Gate Pseudomorphic High
Electron Mobility Transistor |
IPD-Dual LPF
|
|
The Dual LPF*3 for the GSM cellular network
employs IPD*4 technology. The LPF comprises
a high-Q inductor employing thick-film
deposition laminar technology on a GaAs
substrate, low-loss striplines and a capacitor.
This achieves low loss in the signal pass band
ensuring sufficient attenuation (25 dB or more)
at frequency bands that are twice or three
times the basic frequency. We obtained a high
attenuation (20 dB or greater) even at 4 times
and higher frequencies. (See figure 2.)
*3: LPF: Low Pass Filter
*4: IPD: Integrated Passive Device |
Miniature Low-Profile Package
(Lead Frame Module)
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|
This product lineup comes in one resin mold
package based on a lead frame, our existing
package technology, and consists of three chips:
a JPHEMT switch, CMOS decoder and IPD-Dual
LPF. (See figure 3 and figure 4.) |
No DC Cut Capacitor Required on
the RF Port
|
|
Use of Sony's unique circuit technology
employing a CMOS decoder and JPHEMT
switch has made it possible to eliminate the DC
cut capacitor on the RF port. As a result, it has
been possible to reduce the number of parts and
shrink the mounting area on the end product
circuit board. |
Employed as a Reference Design
in Major Mobile Platforms
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|
Terminal manufacturers use mobile
platforms that define the specifications of
the telecommunications hardware, control
software, semiconductor chipsets and other
devices. There is an increasing trend to refer
to the reference design (basic circuit design
drawing) provided by the mobile platform in
the design of terminals. This product lineup
is employed as a reference design in major
mobile platforms and has been designated a
recommended component. |
LTE/CDMA/UMTS/GSM Multimode and
Multiband Low Insertion Loss Antenna
Switch Modules for Mobile Phones
Vol.64