Interposer Substrate
• This is a structural component in semiconductor packages and SiP devices. Semiconductor chips are mounted on the substrate with wire bonding or flip chip technology.
• Performs pitch conversion so semiconductor devices can be mounted on motherboards.
• Extracts the full performance of the ICs used. (This is important for the electrical characteristics, reliability, and thermal dissipation in the end product.)

LAMINATE
• Recently, the term LAMINATE has been used to refer to interposer substrates that have particularly fine feature sizes and large numbers of layers. Sony, in particular, refers to their high-density multilayer build-up interposer substrates (see the following page) as LAMINATE.
• Sony has already achieved a signal line width of 30 μm and is working towards even finer line widths.


Reduced development times, inclusion of diverse chip types
Technology has Become the Core for SiP

Compared to SoC (System on Chip) technology, in which multiple functions are integrated on a single chip, SiP technology has the feature that it can reduce development times and costs by combining multiple chips in a single package.
One reason SiP solutions are of particular interest is that they allow semiconductor devices fabricated using different processes to be combined in a single package.
However, the levels of wiring densities and electrical characteristics required for the SiP interposer substrates have been increasing. By moving these efforts in house, Sony aims to contribute to emiconductor product differentiation by refining these technologies.

SiP Solution that Takes Advantage of Sony's Strengths

In implementing an SiP device, optimal design for LAMINATE and assembly is an important point. At Sony, IC design, board design, and package design are performed as part of a consistent process, making it possible to provide total solutions. This allows Sony to aim for product differentiation in technological level, quality, and cost.