Focusing the power of the Sony group to establish core technologies for high-density mounting
In-House Manufacture of the "LAMINATE" High-Density Multilayer Build-up Interposer Substrate
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Bare chip mounting on a LAMINATE substrate (PiP structure)
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The interposer substrate has become the key technology
for achieving even higher functionality in semiconductor products
such as SiP (system in package) devices.
Until now, Sony has procured interposer substrates from third party suppliers.
However, to extract the best performance from Sony ICs
through technology developments taking place within the Sony Group,
Sony has now taken the step of moving the production of these substrates
in house with the development of the high-density multilayer
build-up interposer substrate called LAMINATE.
Sony has established a LAMINATE mass production line
at the Neagari Plant of Sony Chemical & Information Device Corporation,
the only site of the Sony Group manufacturing substrates
for Sony products, and started mass production in December 2008.
LAMINATE assembles, the combined power of Sony,
a company that has accumulated extensive technology
and know-how concerning chips, substrates, and mounting,
and that has grasped the demands of users and end-product designers.
Starting with the IU046F (8M-pixel lens module for cellular phones)
introduced in Vol.56 of this journal, LAMINATE has been used in
semiconductor packages for digital still cameras, video cameras,
and game equipment, and is contributing to the creation of extremely attractive products. |
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Vol.57
