 Full Firmware Support Provided
Since It is a Full Module |
|
The CXN1600 is a transmission power class 2
full functionality surface mounting module that
supports both headsets and a wide range of
application profiles. The CXN1600 is optimal
for headset and headphone applications and
allows the inclusion of echo canceling and
noise canceling functions in automotive and
other hands-free applications. It can also support
AAC/AAC + Codec, WMA, and other
standards, and supports application software
development to match user needs and even
embedded applications. It includes flash ROM
to make software updates and upgrades possible.
The CXN1600's superlative characteristics and an easy-to-use parameter set mean that it can
be used with confidence in audio applications. |
| External Interfaces |
|
The CXN1600 supports the following extensive
set of interfaces.
• Audio input/output
• UART
• USB
• PCM/I2S
• PIO (16 systems)
• AIO (2 systems)
• LED (2 systems) |
Profile Options
|
|
Users can select from the following wide variety
of profiles according to the application's
needs.
• A2DP
• AVRCP1.3
• PBAP
• OPP
• SPP
• HF1.5
• HS |
| Simplified End Product Power
Supply |
|
The CXN1600 includes both 1.5 V and 1.8 V
regulator circuits (external resonators are
required), and can operate on a single battery
system.
It also includes a power supply charge control
circuit and supports miniature form factors and
reduced costs in products that use rechargeable
batteries.
Power consumption has been reduced by 20%
from the current CXN1450. |
| RF Design |
|
Bluetooth® uses the 2.4 GHz band. The
CXN1600 uses a 50 Ω matching circuit in its
RF input block and can operate an external
antenna with a simple matching circuit. Sony
can also offer consultation on antenna selection,
directional antenna development, and RF circuit
board design. |
| Custom Modules |
|
Sony also provides the CXN1601, which is a
slim version (20.9 × 11.4 × 2.2 mm, 72-pin
LGA without a shield) that features the same
functionality as the CXN1600. Please contact
your Sony representative to discuss modifications
to module-internal circuits, modifications
to package specifications or other design
changes, as well as certification procedures.
*: The Bluetooth® word mark and logo are registered
trademarks of Bluetooth SIG, Inc., and Sony
has received permission to use these trademarks. |
High-Functionality/High-Performance
Compact Bluetooth
Vol.51