CXG1180EQ/1186EQ |
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* Ultralow insertion loss: 0.70 dB in the
GSM 850/900 Tx path and 0.85 dB in
the DCS/PCS Tx path
* Dual low-pass filters:
Attenuation 30 dB typical
(GSM Tx 2fo, DCS/PCS Tx 2fo)
* Lead frame module that adopts a mold
array package
* Miniature low-height package:
LQFN-28P-01
(4.5 mm × 3.2 mm × 1.3 mm max.) |
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Switching Structure that
Achieves Low Insertion Loss |
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Insertion loss is an important index for
switch performance. This parameter
contributes significantly to both current
consumption during transmission and
reception sensitivity in portable terminals.
Switch modules using the conventional
LTCC* substrate adopted a structure in
which the frequency band was divided into
a low band (900 MHz band) and a high
band (1800/1900 MHz band) using a
diplexer, and after that, the path switches
were connected. (See figure 1.) In these
products, Sony adopted the SP6T switch
structure to achieve low loss. These
devices also provide a low-pass filter in
the GSM Tx path. (See figure 2.) In the
conventional LTCC module structure, the
insertion loss for all the paths becomes the
sum of the losses for the diplexer and the path switching switch. As a result, the
overall loss was quite large.
In contrast, in the SP6T structure, only the
switch insertion loss occurs in the paths
other than the GSM Tx path, thus achieving
low loss. Low loss can be achieved
for the GSM Tx path as well, since the
LPF can be implemented with a lower insertion
loss than the diplexer. Furthermore,
these devices achieve ultralow loss
and low distortion by using GaAs switches
implemented using Sony's unique
JPHEMT process as the switching devices.
*: LTCC: Low temperature co-fired ceramic |
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Lead Frame Module |
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In conventional antenna switch modules
used in GSM terminals and other products,
the switches are implemented by
combining, on an LTCC, FR-4, or similar
substrate, PIN diodes and other semiconductor
switching elements and multiple
passive devices inserted on the substrate.
However, considering the demands for
multimode and multiband operation, miniature
low-height form factors, and lower
costs in recent cellular phone products, it
can easily be seen that it will be difficult
to achieve these using these conventional
structures. Sony's response to these issues
was to use the mold array package, which
uses lead frames and is an existing package
technology. These new products are
implemented by mounting, on the lead
frame, both GaAs switches fabricated using
Sony's unique JPHEMT process that achieves both high performance and high
integration densities and high integration
density filters using LTCC technology. By
using existing package technology based
on lead frames, it was possible to use
current manufacturing and assembly
equipment and processes, and thus Sony
is able to supply quality products at low
cost. Furthermore, since these products
consist of two simple components, a GaAs
switching IC and a low-pass filter, they
have the advantage that the development
TAT can be reduced. |
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Miniature Low-Height Form
Factor |
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The mounting area was reduced by integrating
the two low-pass filters for the Tx
paths (two circuits) into one component
using LTCC technology. Also, etching
technology can be used to perform complicated
machining on the lead frame,
which plays the role of interface between
the switch and low-pass filter components
mounted on the lead frame.
Furthermore, Sony optimized the contact
area between the internal low-pass filter
lands and the lead frame and also optimized
the mold sealing thickness above
the low-pass filters, thus achieving a miniature
low-height form factor. |
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•••• Mr.NAGANO••••
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The CXG1180EQ and CXG1186EQ
are antenna switches that feature
low loss. While the function they
provide is simple, this component
has a large influence on the performance
of radio transceivers.
While this could be said to be excessive
concern for such a small
point, I hope this will contribute to
our customers’ creation of superb
radio products. |
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See
all articles with figures and tables.  |
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Vol.39 |
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Sony Corporation Global Headquarters
