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High-Performance
Cellular Phone Antenna Switch/Receiver Module
MMIC with Built-in SAW Element for PDC Full
Packet Terminals
CXM5003
Sony has introduced a full
line of MMIC products for the Japanese cellular
phone market. Sony, with this product, is now
supplying the industry's first antenna switch/
receiver module (includes GaAs switch, low-noise
amplifier/mixer, and SAW devices) that provides
PDC full packet support and was made possible
by using all of Sony's most advanced mounting
technologies. Compared to earlier discrete device
structures, this new module achieves adjustment-free
manufacturing and miniaturization to about 1/3
the mounting area. We hope that you will find
this MMIC useful in your future high-performance
cellular phone and portable communications terminal
development. |
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CXM5003 |
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* Wide bandwidth,
low insertion loss, low distortion
* High gain, low noise figure
* Low LO input power operation
* Miniature package
* Includes duplexer, TOP, and interstage SAW |
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Transmission |
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A full packet terminal
high-power antenna switch MMIC that provides
PDC 800 MHz/1.5 GHz dual band support is used.
This MMIC uses Sony's GaAs junction gate PHEMT
process to achieve both low insertion loss and
low voltage operation. A Si MOS process was
adopted for the logic chip to reduce current
consumption. The CXM5003 achieves simultaneous
reception in full packet mode and uses an MMIC
that provides 2 transmitter and 3 receiver ports
for four antennas. It achieves even further
miniaturization by using surface mounting for
the SAW duplexer and matching components. |
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Reception |
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The CXM5003 uses an
MMIC that consists of three low-noise amplifiers
(one each for the LNA 800 MHz CD band, 800 MHz
A band, and 1.5 GHz band) and two mixers. This
MMIC uses Sony's GaAs J-FET process to achieve
high sensitivity and low distortion. The CXM5003
reduces the RF design burden by eliminating
the need for the low-noise amplifier/mixer I/O
matching* and saw filter I/O matching, which
were indispensable in conventional discrete
structures. This can contribute to speeding
up the product development cycle.
*: Except for the LO input
block and IF output block matching. |
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Structure |
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The CXM5003 differs
from the conventional single molded structure
in that a two-cavity molded resin sealed structure
is adopted. In this structure, the SAW filter
and chip components are surface mounted on an
organic circuit board and after the switching
and logic chip and the low-noise amplifier/mixer
chip are mounted individually on the back of
the circuit board, the device is sealed in the
two-cavity structure. The adoption of this structure
has allowed Sony to provide a module that is
extremely general and can significantly reduce
the mounting area required for this functionality. |
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Miniature
Module |
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The CXM5003 has a
51-pin structure and is a miniature module with
a size of only 7.25 mm x 9.3 mm x 1.55 mm. This
module can contribute to reduction of the mounting
area required and further miniaturization in
cellular phones. |
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•••• Mr.NOGUCHI ••••
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In developing the
CXM5003, we were quite aggressive about adopting
new technologies, and there were times when
we came together as a group in perfect synchronization
and became so engrossed in the project that
we forgot about time. I am convinced that this
product will more than meet our customers' needs.
I strongly suggest that you look into this device
for your next product. It is clear that even
higher added value features will be required
for domestic Japanese PDC cellular phones in
the future. We are com-mitted to developing
easy-to-use products that can meet these needs. |
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See
all articles with figures and tables.  |
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Vol.37 |
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