Both Higher
Output and Higher Speed Achieved |
|
While increases in
both the output transient waveform speed and
the maximum output drive current are required
to achieve higher linear velocities, increasing
the maximum output drive current requires increasing
the size of the output transistors, and this
leads to delays of the output transient waveform.
The CXA2697ER makes x12-speed DVD recording
possible, first by providing the ability to
supply the required maximum output drive currents
under severe conditions for both CD and DVD
as follows:
* CD system total maximum drive current: 370
mA (See figure 1.) (Vcc = 3.3 V, VccLD = 5 V,
Vop = 2.5 V)
* DVD system total maximum drive current: 450
mA (See figure 2.) (Vcc = 3.3 V, VccLD = 5 V,
Vop = 3 V),
and second, by optimizing the output transient
waveform with an internal waveform shaping circuit
to be both high speed and to have minimal overshoot.
This makes x12-speed DVD recording possible. |
Read Channel
Low Noise |
|
To achieve the signal-to-noise
ratio required for high linear velocities,
Sony adopted thoroughgoing low-noise design
techniques in this IC to achieve the low noise
level of 1.5 nA/√Hz (at 20 MHz, 35 mA, 20
mAp-p). |
High-Frequency
Modulator Frequency Accuracy |
|
In high-frequency
modulator, which is used to reduce noise during
playback, interference may occur between the
return light from the disc surface and the laser
beam due to variations in frequency. This can
aggravate noise. However, the CXA2697ER reduces
noise by canceling the internal resistance dependent
frequency variations generated in the VCO,
which uses an emitter junction multivibrator. |
DVD System
Modulator Amplitude Switching |
|
This function allows
applications to set an optimal modulator amplitude
for the DVD system media used. |
Support for
Various Timing Signals |
|
The CXA2697ER supports
both differential inputs (LVDS) for higher
speeds and single-ended inputs (3.3 V CMOS/TTL)
for the timing inputs. |
Small Package
Adopted |
|
The CXA2697ER is provided
in a 32-pin VQFN (4.8 mm x 4.8 mm) small package
and can contribute to pickup miniaturization
by reducing the mounting area. In addition to
this small package size, the CXA2697ER also
features exposure of the die pads on the package
surface. This allows heat dissipation to be
improved by close contact between the die pads
and a heat sink using silicone grease. Since
this prevents the heat from being transmitted
to the laser diode through the mounting substrate,
it makes an optimal substrate for the laser
diode and at the same time also allows wiring
on the back side of the IC. |